The XCKU040-2FBVA676E by AMD is a high-performance member of the Kintex® UltraScale™ FPGA series. Engineered for advanced system-level applications, this FPGA is available in a 676-ball Fine-Pitch Ball Grid Array (FCBGA) package, enabling a robust surface mount assembly. Its design caters to a demanding operational temperature range from 0°C to 100°C (TJ), ensuring reliability in a broad spectrum of environments.

With an impressive configuration of 530,250 logic elements and 30,300 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this component delivers the computational power required for high-speed data processing and complex logic operations. The XCKU040-2FBVA676E is also equipped with 21,606,000 total RAM bits, facilitating extensive data storage and management capabilities essential for data-intensive tasks.

Connectivity is a strong suit for this FPGA, offering 312 I/O ports that provide ample interfacing options with other components in sophisticated electronic systems. This versatility and high interface count make it suitable for applications across a variety of industries, including but not limited to, telecommunications, data processing, aerospace, and defense.

This device is currently active, reflecting AMD’s commitment to supplying the industry with state-of-the-art FPGAs that meet the evolving needs of technology developers. The packaging form factor is tray, which is typical for components of this complexity and supports the needs of volume assembly and manufacturing processes. The XCKU040-2FBVA676E stands out for its integration capabilities, performance efficiency, and adaptability to complex electronic systems, underscoring AMD’s excellence in the FPGA market.