Why third-party testing?
At Microchip USA, we understand that the quality of the Integrated Circuits we sell is essential to our business. That’s why we use third-party labs to test and verify our ICs.
We believe that the use of in-house testing labs is a conflict of interest. This is because the same organization is selling and verifying the parts. This can create a bias, as the organization may be reluctant to find defects in its own products.
Third-party labs, on the other hand, are independent of the company that designed the IC. This means that they can be more objective in their testing and are less likely to be influenced by financial considerations.
For these reasons, we believe that using third-party labs to test and verify our ICs is the best way to ensure the quality and reliability of our products.
Here are some of the potential risks of using in-house testing labs:
- The lab may be reluctant to find defects in its own products, as this could damage the company’s reputation.
- The lab may not have the same level of expertise as a third-party lab.
- The lab may not have the same level of independence as a third-party lab.
As third-party labs have a vested interest in providing accurate and unbiased results, since their reputation depends on it, we believe that the use of third-party labs is the best way to mitigate these risks. Additionally, independent labs have the expertise and resources to test ICs in a comprehensive and objective way.
Microchip USA is committed to providing our customers with the best possible components, and we believe that using third-party labs is an essential part of ensuring the quality and reliability of our ICs.
What labs do we use?
What tests are available?
Microchip USA’s independent testing partners utilize a standard series of tests, including electrical testing, decapsulation, and X-ray inspection. However, many types of verification testing are available from our partners. Some available tests include:
|Decapsulation and Internal Die Verification
|To identify internal defects
|The outer encapsulation of the IC is removed to expose the internal die. The die is then inspected visually and with a microscope.
|X-Ray Inspection & Analysis
|To identify internal defects
|X-rays are used to create images of the internal structure of the IC. These images can be used to identify defects that are not visible to the naked eye.
|External Visual Inspection
|To identify external defects
|The external surface of the IC is inspected visually for defects.
|Surface Texture Analysis
|To identify surface defects
|A scanning electron microscope (SEM) is used to analyze the surface texture of the IC. This can be used to identify defects, such as scratches, pits, or bumps.
|Electric Pin Correlation
|To verify the electrical connections between the pins of an IC
|The electrical characteristics of each pin on the IC are measured. The measurements are then compared to the expected values to identify any discrepancies.