Maximize the potential of your high-performance computing and digital signal processing applications with the XC7K325T-L2FBG900I from AMD. This advanced component from the Kintex®-7 FPGA series is a testament to AMD’s commitment to providing leading-edge solutions for complex digital designs. Engineered for surface mount assembly, this FPGA is housed in a 900-BBGA, FCBGA package, ensuring robust physical integration into your systems.

The XC7K325T-L2FBG900I operates across a wide temperature range from -40°C to 100°C (TJ), making it suitable for demanding environments. Its architecture comprises 326,080 logic elements/cells and 25,475 LABs/CLBs, facilitating the development of highly intricate digital circuits. With 16,404,480 total RAM bits, this FPGA can manage substantial data throughput, a key attribute for applications necessitating substantial memory resources.

Equipped with 500 I/O, this FPGA offers versatile connectivity options, accommodating a variety of peripherals and interfaces essential in telecommunications, automotive, defense, and aerospace applications. The component’s package, a 900-FCBGA (31×31), permits efficient space utilization on PCBs, an essential feature for designs requiring high-density component layouts.

Key Features:
– Manufacturer: AMD
– Part Number: XC7K325T-L2FBG900I
– Series: Kintex®-7
– Packaging: Tray
– Mounting Type: Surface Mount
– Operating Temperature: -40°C ~ 100°C (TJ)
– Logic Elements/Cells: 326,080
– LABs/CLBs: 25,475
– Total RAM Bits: 16,404,480
– Number of I/O: 500
– Package / Case: 900-BBGA, FCBGA
– Part Status: Active

The XC7K325T-L2FBG900I represents a confluence of density, performance, and versatility, making it an ideal choice for engineering professionals seeking leading-edge FPGA solutions for their high-stakes projects.