The XC7K325T-2FFG900I, crafted by AMD, falls within the category of advanced FPGAs and is a crucial member of the Kintex®-7 series. This FPGA is engineered to deliver high performance for applications requiring intense logic operations and high-speed connectivity. It comes in a 900-BBGA, FCBGA package, optimized for surface mount technology, making it suitable for efficient assembly on printed circuit boards.

Operating at a temperature range of -40°C to 100°C, this component ensures reliability and endurance across various environmental conditions. With a formidable count of 326,080 logic elements/cells and 25,475 LABs/CLBs, the XC7K325T-2FFG900I is designed to address the complex computational demands of modern high-speed digital systems. Its significant data storage capacity is highlighted by 16,404,480 total RAM bits, accommodating comprehensive memory needs and facilitating high-performance tasks seamlessly.

The FPGA features an expansive array of 500 I/O ports, providing extensive connectivity options and enhancing its flexibility for integration into a wide range of electronic systems. Packaged in a 900-FCBGA configuration, it offers a compact footprint while enabling the performance characteristics vital to computing, telecommunications, industrial, and even aerospace applications, where precision and reliability are paramount.

AMD’s XC7K325T-2FFG900I remains an active and powerful solution for designers and engineers looking to leverage the advanced capabilities of the Kintex®-7 series in developing cutting-edge technology projects and applications.