The XC7K325T-2FFG900C, a high-performance FPGA from AMD’s Kintex®-7 series, stands out due to its integration of 326,080 logic elements and 25,475 logic array blocks, making it an ideal choice for complex digital processing tasks. Housed in a 900-BBGA, FCBGA package, this component ensures reliable connectivity and durability with its surface mount technology. Suitable for operating temperatures ranging from 0°C to 85°C, it provides flexibility for use in various environmental conditions.

With a substantial 16,404,480 total RAM bits and an extensive array of 500 I/O pins, the XC7K325T-2FFG900C offers unparalleled data handling and interfacing capabilities. The FCBGA packaging further ensures a compact footprint while maintaining high performance, making it a go-to choice for designers seeking efficient space utilization without compromising on computational power.

This component is actively utilized across various industries, including telecommunications, data processing, aerospace, and defense, where its advanced processing power and capacity for handling complex algorithms and data-intensive applications are crucial. The combination of high-density logic elements, substantial memory, and extensive input/output options encapsulates the need for versatile, high-performance computing solutions in these demanding sectors.

The XC7K325T-2FFG900C is currently available in tray packaging, confirming its readiness for bulk application deployments and integration into sophisticated electronic systems. It represents AMD’s commitment to providing cutting-edge technology solutions that meet the evolving needs of the industry, maintaining a legacy of innovation and reliability in the FPGA market.