The XC7K325T-2FFG676C, manufactured by AMD, is a high-caliber FPGA from the revered Kintex®-7 series. This component is encapsulated in a 676-BBGA, FCBGA package, ensuring robust performance and reliability for surface mount technology applications. Specifically designed to meet the advanced requirements of a wide array of industries, including telecommunications, automotive, aerospace, and consumer electronics, this FPGA stands out due to its impressive array of features.

It operates efficiently across a temperature range of 0°C ~ 85°C (TJ), making it versatile for various environmental conditions. With a substantial number of Logic Elements/Cells totaling 326,080 and an impressive count of 25,475 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), it offers unparalleled flexibility and capacity for complex digital circuit designs. Additionally, the XC7K325T-2FFG676C is equipped with 16,404,480 total RAM bits, providing significant memory resources for demanding applications.

This FPGA also features a generous number of Input/Output pins (I/O), totaling 400, which allows for a wide range of connections and interfaces with other components in a system. Packaged conveniently in a 676-FCBGA (27×27) supplier device package, it ensures a reliable and efficient assembly process. Currently, with an active part status, this FPGA remains a crucial component for designers seeking high performance and scalability in their digital and signal processing projects.