The XC7K325T-1FF900I is a high-performance FPGA from AMD’s Kintex®-7 series, designed to meet the demanding requirements of high-end applications. This component is housed in a 900-BBGA, FCBGA package, optimized for surface mount technology, ensuring a robust integration into a variety of printed circuit board designs. With its operating temperature range of -40°C to 100°C, this FPGA is engineered for reliability across diverse environmental conditions, making it a versatile choice for industries requiring high levels of computational power and durability.

This FPGA boasts a substantial number of Logic Elements/Cells, totaling 326,080, combined with 25,475 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), underscoring its capability to tackle complex digital processing tasks efficiently. With an impressive total RAM Bits of 16,404,480, the XC7K325T-1FF900I offers extensive data storage and manipulation capabilities, crucial for applications involving large datasets or requiring rapid data throughput.

The device supports up to 500 I/O ports, providing ample connectivity options for interfacing with other components within a system, enhancing its flexibility for integration into a wide array of electronic designs. Packaged in a 900-FCBGA (31×31) footprint, this FPGA combines compact design with powerful performance features. Given its active part status, the XC7K325T-1FF900I represents AMD’s ongoing commitment to delivering cutting-edge FPGA solutions.

Ideal for applications within the telecommunications, networking, data processing, and industrial sectors among others, this FPGA enables designers to achieve high-speed data processing and versatile system design with a single chip, embodying the innovation and reliability synonymous with AMD’s Kintex®-7 series.