Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC7A75T-1FGG676I is a highly sophisticated Field-Programmable Gate Array (FPGA) from AMD, belonging to the renowned Artix-7 series. This component is housed in a 676-ball Fine Pitch Ball Grid Array (FBGA) package, enabling a compact footprint while allowing for dense circuit integration. It is designed for surface mount technology, ensuring easy assembly and integration into various applications. The part operates over a broad temperature range from -40°C to 100°C, making it suitable for demanding environments.
With an impressive array of 75,520 logic elements and 5,900 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), this FPGA is engineered to tackle complex digital computations and signal processing tasks efficiently. The XC7A75T-1FGG676I stands out with its considerable total RAM bits of 3,870,720, providing substantial memory resources for high-performance applications.
Additionally, it offers up to 300 I/O ports, facilitating versatile connectivity options for interfacing with other components in a system. The device is currently marked as active, indicating its availability for new designs and integration into existing ones.
AMD’s Artix-7 series FPGAs, including the XC7A75T-1FGG676I, are widely recognized for their performance and flexibility. They are extensively utilized across various industries, including telecommunications, automotive, defense, and consumer electronics, for applications ranging from signal processing, video and image processing, to complex digital systems requiring adaptive hardware configurations.
Overall, the XC7A75T-1FGG676I embodies a powerful solution for designers seeking to leverage FPGA technology for advanced system development, showcasing a balance of performance, flexibility, and reliability.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 676-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 0.95V ~ 1.05V |
Number of Logic Elements/Cells | 75520 |
Supplier Device Package | 676-FBGA (27x27) |
Number of LABs/CLBs | 5900 |
Total RAM Bits | 3870720 |
Part Status | Active |
Number of I/O | 300 |
Programmable | Not Verified |
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
Integrated Circuits (ICs) form the foundation of modern electronics, enabling complex functionality in compact packages. NXP, a pioneer in semiconductor technology, has a rich history…
Xilinx’s Virtex UltraScale+ platform is shaping the future of high-performance computing. This cutting-edge field-programmable gate array (FPGA) technology enables rapid innovation in emerging applications requiring…
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 72 I/O 84PLCC
IC FPGA 532 I/O 780FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
IC FPGA 226 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
The Microchip USA newsletter is your free resource for industry news, MUSA updates, and education. Stay informed and up-to-date. Discover our company updates, cutting-edge articles, and enhance your skills with relevant educational content to stay ahead of the curve.
Thank you for Signing Up |