Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC6SLX75-2FGG484C, a pivotal component from AMD’s renowned Spartan®-6 LX series, stands out within the FPGA category for its advanced capabilities and robust design. Crafted for surface mount application, it comes in a 484-BBGA package, ensuring a high-degree of reliability and integration flexibility for designers. This FPGA is engineered to operate optimally within a 0°C to 85°C temperature range, catering to a wide array of environmental conditions.
Noteworthy specifications include an impressive number of logic elements/cells totaling 74,637, complemented by 5,831 LABs/CLBs, which facilitate complex digital circuit designs. Its memory architecture, boasting 3,170,304 total RAM bits, supports extensive data storage and manipulation capabilities essential for high-performance computing tasks.
With 280 configurable I/O pins, this FPGA offers ample connectivity for interfacing with other components, enhancing its utility in multi-faceted electronic designs. Its active part status and packaging in a tray option affirm its ongoing relevance and availability in the market.
The robust features of the XC6SLX75-2FGG484C make it an indispensable asset in various industries, including telecommunications, automotive, consumer electronics, and industrial automation, where high-speed data processing and system reliability are paramount.
Key Features:
– 74,637 Logic Elements/Cells for complex digital implementations
– 5,831 LABs/CLBs support an extensive range of design configurations
– 3,170,304 Total RAM Bits for advanced data management
– 280 I/O pins providing significant interfacing capability
– Packaged in a convenient 484-BBGA, suited for surface mount techniques
– Designed for operational reliability within a 0°C ~ 85°C temperature range
This Spartan®-6 LX series component by AMD demonstrates exceptional versatility and performance capabilities, catering to the demanding requirements of cutting-edge digital systems design.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Logic Elements/Cells | 74637 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 5831 |
Total RAM Bits | 3170304 |
Part Status | Active |
Number of I/O | 280 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 177 I/O 256FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 207 I/O 400VFBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 150 I/O 324CSBGA
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