Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC6SLX45T-3FGG484C, a high-performance FPGA from AMD’s Spartan®-6 LXT series, is tailored for demanding applications requiring robust processing capabilities. This component is housed in a 484-BBGA package and designed for surface mount technology, ensuring a compact form factor suitable for densely packed PCBs. With an operational temperature range of 0°C to 85°C, it demonstrates resilience in varied environmental conditions.
Featuring 43,661 logic elements/cells and 3,411 LABs/CLBs, the XC6SLX45T-3FGG484C delivers substantial logic processing power. The device is equipped with 2,138,112 total RAM bits, offering considerable memory resources for data-intensive operations. Furthermore, it supports up to 296 I/Os, providing extensive interfacing capabilities with other components within a system.
The device’s packaging format is a tray, facilitating efficient handling and assembly processes in manufacturing environments. As an active component within the FPGA category, it maintains a significant role in the development of advanced electronic systems.
Industries that benefit from the advanced features of the XC6SLX45T-3FGG484C include telecommunications, automotive, defense, and consumer electronics, where its performance and versatility drive innovation in product development and system optimization. The Spartan®-6 LXT series is known for delivering cost-effective, yet powerful solutions for applications requiring high-speed digital signal processing and high-bandwidth data paths, making this component a go-to choice for engineers looking to push the boundaries of their technological projects.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Logic Elements/Cells | 43661 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 3411 |
Total RAM Bits | 2138112 |
Part Status | Active |
Number of I/O | 296 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 341 I/O 484FBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA ARTIXUP 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 140 I/O 176TQFP
IC FPGA 475 I/O 672FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 81 I/O 100TQFP
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