Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC6SLX4-2CSG225I, crafted by AMD, is a high-caliber FPGA from the acclaimed Spartan®-6 LX series, renown for its capability to meet the intricate demands of modern digital processing. Packaged in a 225-LFBGA, CSPBGA format, this component demonstrates an adept flexibility in design applications, courtesy of its surface mount architecture. Ensuring robust performance across a diverse array of environments, it is engineered to operate within a temperature range of -40°C to 100°C (TJ), catering to high-reliability requirements.
With an impressive array of 3840 logic elements/cells and 300 LABs/CLBs, this device is structured to optimize logic density for medium complexity solutions. Its 221184 total RAM bits and expansive count of 132 I/O ports further accentuate its utility in handling extensive data throughput and interfacing capabilities, making it a preferred choice for developers in sectors requiring high data integrity and swift processing capabilities such as communications, automotive systems, and industrial controls.
The XC6SLX4-2CSG225I is presented in a 225-CSPBGA (13×13) supplier device package, a testament to AMD’s dedication to providing versatile and durable solutions. Despite its extensive capabilities, it holds an “Active” part status, indicating its continued production and support for future projects. In essence, this FPGA embodies a blend of performance, flexibility, and reliability, enhancing its suitability for a wide array of applications requiring high-speed digital processing and intricate logic operations.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 225-LFBGA, CSPBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.14V ~ 1.26V |
Number of Logic Elements/Cells | 3840 |
Supplier Device Package | 225-CSPBGA (13x13) |
Number of LABs/CLBs | 300 |
Total RAM Bits | 221184 |
Part Status | Active |
Number of I/O | 132 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 341 I/O 484FBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 140 I/O 176TQFP
IC FPGA 186 I/O 256FBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 113 I/O 144TQFP
IC FPGA 81 I/O 100TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 226 I/O 324CSBGA
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