Introducing the XC5VLX85-3FFG676C, a high-performance component from AMD’s prestigious Virtex®-5 LX series of Field Programmable Gate Arrays (FPGAs). This advanced chip has been meticulously designed to meet the rigorous demands of a wide array of applications including, but not limited to, telecommunications, automotive systems, aerospace, and defense industries. As a testament to its versatility and reliability, the XC5VLX85-3FFG676C finds itself at the heart of complex digital processing tasks, offering unparalleled speed and efficiency.

Key features of the XC5VLX85-3FFG676C include:
– A robust 676-ball Fine-Pitch Ball Grid Array (FCBGA) packaging ensuring secure and reliable mounting with a package size of 27×27 mm, optimized for high-density circuit designs.
– Extensive operability within a temperature range of 0°C to 85°C (TJ), guaranteeing performance under varying environmental conditions.
– A powerful network of 82,944 logic elements/cells and 6,480 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), facilitating complex logic operations and algorithms.
– Generous integration of 3,538,944 total RAM bits, providing significant on-chip memory resources for efficient data management and storage.
– The capability to manage up to 440 inputs/outputs, allowing for extensive interfacing with other components and systems within a given design architecture.

As an active component, the XC5VLX85-3FFG676C continues to be a key player in the development of cutting-edge technologies and systems, offering developers and designers a flexible and powerful platform for innovation. With surface mount technology, it seamlessly integrates into a wide range of electronic assemblies, ensuring ease of design and implementation for advanced projects.