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XC5VLX30T-1FFG665C

IC FPGA 360 I/O 665FCBGA

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$582.40

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The XC5VLX30T-1FFG665C, crafted by AMD, stands as a high-performance FPGA component within the renowned Virtex®-5 LXT series. This device is meticulously designed to meet the rigorous demands of advanced digital processing, offering a robust solution for a variety of industry applications including telecommunications, aerospace, and defense systems, as well as data processing and storage solutions. This FPGA is notable for its sophisticated architecture that supports a wide range of operating temperatures from 0°C to 85°C (TJ), ensuring reliability and performance under various environmental conditions.

Key features of the XC5VLX30T-1FFG665C include:

– Part of the Virtex®-5 LXT series known for its superior logic capability and performance efficiency.
– Engineered for surface mount technology with a 665-FCBGA (27×27) package, facilitating streamlined integration into PCB designs.
– Boasts 30,720 logic elements/cells and 2,400 LABs/CLBs, offering remarkable configurability and density for complex digital circuits.
– Total RAM bits amounting to 1,327,104, enabling significant data storage and manipulation capacity.
– Provides 360 input/output options, extending flexibility in interfacing with a multitude of external devices and components.
– The device is supplied in tray packaging, ensuring components’ integrity during transportation and before assembly.

The XC5VLX30T-1FFG665C is actively available to cater to both current and emerging needs in FPGA technology deployment, facilitating advancements in electronic design and implementation across critical industries. With its combination of high-density logic, expansive memory, and versatile I/O capabilities, this FPGA component offers an optimal solution for developers and engineers aiming to push the boundaries of technology applications.

Additional information

Additional Information

Series: Virtex®-5 LXT
RoHS Status: ROHS3 Compliant
Manufacturer Lead Time: 35 week(s)
Product Status: Active
Packaging: Tray

Datasheet:

Download Free CAD Model:

Technical Details:
PackagingTray
Package / Case665-BBGA, FCBGA
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Voltage - Supply0.95V ~ 1.05V
Number of Logic Elements/Cells30720
Supplier Device Package665-FCBGA (27x27)
Number of LABs/CLBs2400
Total RAM Bits1327104
Part StatusActive
Number of I/O360
ProgrammableNot Verified
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