Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The XC5VLX30-2FF324I, crafted by AMD, falls within the category of Field Programmable Gate Arrays (FPGAs) and is a prominent member of the Virtex®-5 LX series. This component is encapsulated in a 324-BBGA, FCBGA package, ensuring a robust and reliable connection when mounted on a surface with its surface mount technology. Designed to operate within a broad temperature range of -40°C to 100°C (TJ), it offers versatility for various environmental conditions.
This FPGA boasts a substantial configuration of logic elements/cells, amounting to 30,720, harmonized by 2,400 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), positioning it as a highly capable choice for demanding applications. Furthermore, it is equipped with an expansive memory, offering 1,179,648 total RAM bits, which allows for efficient data management and storage capabilities.
With a total of 220 inputs and outputs (I/O), the XC5VLX30-2FF324I ensures expansive connectivity options, facilitating communication and interfacing with multiple peripherals or systems. Its active status underscores its ongoing relevance and availability in today’s market, making it a preferred option for professionals in areas such as telecommunications, aerospace, defense, and high-performance computing applications, where its advanced features and reliability can be fully leveraged.
The device’s packaging in a tray format and its specification under the 324-FCBGA (19×19) supplier device package further highlight its design for secure handling and integration into various system configurations, underscoring its adaptability and ease of deployment in complex projects.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 324-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 0.95V ~ 1.05V |
Number of Logic Elements/Cells | 30720 |
Supplier Device Package | 324-FCBGA (19x19) |
Number of LABs/CLBs | 2400 |
Total RAM Bits | 1179648 |
Part Status | Active |
Number of I/O | 220 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 83 I/O 100QFP
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
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