Introducing the XC3S200-4PQG208C from AMD, a pivotal component in the realm of Field-Programmable Gate Arrays (FPGAs) distinguished by its membership in the Spartan®-3 series. This product is encapsulated within a 208-BFQFP (Ball Flat Quadruple Package), optimized for surface mount technology applications. Designed to excel in a range of operating temperatures from 0°C to 85°C (TJ), this FPGA is tailored for environments demanding precision and durability.

Key features and specifications include:

– Packaged in a tray for secured handling and delivery.
– Encased in a 208-PQFP (28×28), facilitating seamless integration into varied circuit designs.
– Boasts 4,320 logic elements/cells and 480 LABs/CLBs, offering robust flexibility and capability for complex programming tasks.
– Accommodates a comprehensive Landscape Architecture for Binary computing (LAB) structure combined with 221,184 total RAM bits, enabling substantial data management and processing activities.
– Equipped with 141 I/O ports, the XC3S200-4PQG208C ensures extensive connectivity and interoperability within electronic systems.
– Although marked obsolete, its advanced features continue to make it a valuable asset across industries such as telecommunications, automotive electronics, consumer electronics, and aerospace technologies, where reliability and performance are paramount.

The XC3S200-4PQG208C embodies AMD’s commitment to innovation in FPGA technology, providing a versatile solution for sophisticated electronic designs and applications requiring high levels of computation and data processing capability.