Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EPF8636AQC208-4, crafted by Intel, stands as a pivotal component within the FLEX 8000 series of Field Programmable Gate Arrays (FPGAs). This distinguished part sports a form factor of 208-BFQFP, designed specifically for surface mount technology, facilitating its integration into a wide array of electronic assemblies. With an operational temperature range of 0°C to 70°C (TA), this FPGA is built to maintain reliable performance under standard industrial conditions.
Featuring a substantial array of 504 logic elements/cells and 63 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), the EPF8636AQC208-4 offers a versatile foundation for developing complex digital circuits. This adaptability is further underscored by its provision of 136 input/output (I/O) ports, empowering engineers with extensive connectivity options for peripheral devices.
Packaged in a 208-PQFP (28×28), this FPGA is tailored for projects demanding high-density integration without compromising on performance. Despite its status as an obsolete component, the EPF8636AQC208-4 continues to be a valuable asset for specialized applications in various industries, including but not limited to telecommunications, automotive electronics, and consumer electronic products, where its robustness and flexibility enable the realization of complex digital functionality.
Intel’s commitment to advancing FPGA technology is exemplified in the design and capabilities of the EPF8636AQC208-4, promising an efficient and powerful solution for sophisticated electronic designs requiring a high degree of programmability and customization.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 208-BFQFP |
Mounting Type | Surface Mount |
Number of Gates | 6000 |
Operating Temperature | 0°C ~ 70°C (TA) |
Voltage - Supply | 4.75V ~ 5.25V |
Number of Logic Elements/Cells | 504 |
Supplier Device Package | 208-PQFP (28x28) |
Number of LABs/CLBs | 63 |
Part Status | Obsolete |
Number of I/O | 136 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 341 I/O 484FBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 248 I/O 484BGA
IC FPGA ARTIXUP 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 475 I/O 672FBGA
IC FPGA 532 I/O 780FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 81 I/O 100TQFP
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