The EPF8282ATI100-3, from Intel’s FLEX 8000 series, is a high-performance Field-Programmable Gate Array (FPGA) encapsulated in a 100-pin Thin Quad Flat Package (TQFP) with dimensions of 14×14 mm. Designed for surface mounting, this FPGA operates within an ambient temperature range of -40°C to 85°C, making it suitable for a wide range of industrial applications where reliability under varying thermal conditions is paramount.

Featuring 208 logic elements/cells and 26 logic array blocks (LABs)/configurable logic blocks (CLBs), the EPF8282ATI100-3 provides a robust platform for designing complex digital circuits with a high degree of flexibility. This component boasts 78 input/output (I/O) pins, facilitating extensive interfacing capabilities with other parts of a system.

As a product categorized under the obsolete part status, it highlights the evolution and rapid development within the field of programmable logic devices, yet it remains a valuable resource for maintaining or recreating legacy systems across a variety of industries, including but not limited to telecommunications, consumer electronics, and automotive systems.

The packaging in trays ensures that the EPF8282ATI100-3 is well protected and suitable for bulk handling during the manufacturing and integration process, ensuring that the component remains in optimal condition from factory to application.

Intel’s commitment to quality and innovation is evident in the FLEX 8000 series, making the EPF8282ATI100-3 a go-to option for professionals seeking reliable, high-performance FPGAs for sophisticated digital systems.