The EPF6024AQC208-3N, crafted by Intel, stands as a commendable FPGA (Field-Programmable Gate Array) belonging to the esteemed FLEX 6000 series. Engineered meticulously for surface mount applications, it showcases an advanced 208-BFQFP (Bumpered Flat Quad Flat Package) design, promising a seamless integration within a wide spectrum of circuit layouts. This component finds itself at the core of complex, yet crucial applications across various industrious sectors, including telecommunications, automotive industries, and consumer electronics, to name a few. Notably, its robust build allows operation within a temperature range of 0°C to 85°C, ensuring reliability under varied environmental conditions.

Key Specifications:
– Part manufactured by Intel, marking a high standard in FPGA technology.
– Belongs to the FLEX 6000 series, aligning with advanced digital circuit requirements.
– Presented in a 208-BFQFP, ensuring ease of mounting on surface-type boards.
– Operates efficiently within a temperature range of 0°C to 85°C.
– Encompasses 1960 logic elements/cells and 196 LABs/CLBs, supporting sophisticated digital designs.
– Features 171 I/O ports, offering extensive connectivity for a multitude of applications.
– Packaged in a tray for secure handling and delivery.
– Note: This part is marked as obsolete, indicating its unique value for specific applications or for collectors.

The EPF6024AQC208-3N by Intel is not just an FPGA; it represents a blend of precision engineering with versatility, serving as a quintessential component for enhancing the functionality and reliability of high-demand systems in several key industries.