Analog Devices Amplifiers
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The Intel EPF6024AQC208-3 is a high-performance FPGA part of the renowned FLEX 6000 series, designed to meet the rigorous demands of advanced digital circuit implementations. This component is encapsulated in a 208-BFQFP (Ball Flat Quad Flat Package) with a surface mount configuration, making it suitable for streamlined assembly processes and compact system designs. It operates within a temperature range of 0°C to 85°C, ensuring reliability across various operating environments.
With 1960 logic elements/cells and 196 LABs (Logic Array Blocks) or CLBs (Configurable Logic Blocks), this FPGA provides a flexible and powerful platform for creating complex logic circuits and functions. The device also features 171 I/O pins, offering extensive connectivity options for peripheral and interface applications. Packaged in a 208-PQFP (28×28) supplier device package, it facilitates efficient use of board space without sacrificing performance.
Although now classified as obsolete, the EPF6024AQC208-3 has been a cornerstone in the development of a myriad of applications across different industries, including telecommunications, computing, industrial control systems, and consumer electronics. Its versatility and robustness have made it a preferred choice for engineers and designers looking to incorporate reliable programmable logic solutions in their projects.
Given its sophisticated capabilities and broad application spectrum, the Intel EPF6024AQC208-3 remains a valuable component for those in the industry with specific legacy system needs or those undertaking specialized projects where this particular FPGA’s characteristics are indispensable.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 208-BFQFP |
Mounting Type | Surface Mount |
Number of Gates | 24000 |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 3V ~ 3.6V |
Number of Logic Elements/Cells | 1960 |
Supplier Device Package | 208-PQFP (28x28) |
Number of LABs/CLBs | 196 |
Part Status | Obsolete |
Number of I/O | 171 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 83 I/O 100QFP
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