Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EPF10K30ETI144-2 is a critical component in the FLEX-10KE® series of Field Programmable Gate Arrays (FPGAs). This device is offered in a 144-LQFP package, designed for surface mount technology, enabling a more streamlined integration into a variety of electronic assemblies. The FPGA operates within a temperature range of -40°C to 85°C, making it suitable for applications that may experience extreme operating environments.
Built around 1728 logic elements/cells and featuring 216 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), this FPGA provides a flexible and powerful solution for complex digital circuits. With a substantial 24576 total RAM bits and 102 I/O pins, it accommodates a wide range of data-intensive operations and interfaces.
The EPF10K30ETI144-2 has found applications across an array of sectors due to its adaptable and programmable nature. Its capability to support various logic configurations makes it a preferred option in telecommunications, computing, industrial automation, and consumer electronics, among other fields.
Although marked as obsolete, the EPF10K30ETI144-2 continues to be an invaluable resource for system designers and engineers looking for a reliable FPGA solution that combines flexibility with performance. The component encapsulates Intel’s commitment to advanced technology in the FPGAs category, ensuring precise and efficient operations wherever deployed. Its package type, 144-TQFP (20×20), further ensures compatibility with modern PCB assembly techniques.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 144-LQFP |
Mounting Type | Surface Mount |
Number of Gates | 119000 |
Operating Temperature | -40°C ~ 85°C (TA) |
Voltage - Supply | 2.375V ~ 2.625V |
Number of Logic Elements/Cells | 1728 |
Supplier Device Package | 144-TQFP (20x20) |
Number of LABs/CLBs | 216 |
Total RAM Bits | 24576 |
Part Status | Obsolete |
Number of I/O | 102 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 341 I/O 484FBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 72 I/O 84PLCC
IC FPGA 83 I/O 100QFP
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 207 I/O 400VFBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 315 I/O 484FBGA
IC FPGA 176 I/O 256UBGA
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