The Intel EPF10K30BC356-4 FPGA, part of the innovative FLEX-10K® series, stands out with its advanced features tailored for high-performance applications. This Field Programmable Gate Array is encapsulated in a 356-LBGA (Ball Grid Array) package, showcasing Intel’s commitment to delivering compact, powerful solutions. With a surface mount design, it is engineered for seamless integration into a wide range of electronic assemblies, ensuring a robust, reliable connection for critical applications.

The versatility of the EPF10K30BC356-4 is evident in its operating temperature range of 0°C to 70°C, making it suitable for use in environments that demand consistent performance under varying thermal conditions. This FPGA boasts 1,728 logic elements/cells and 216 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), providing a solid foundation for designing complex digital circuits. Equipped with 12,288 total RAM bits and an expansive 246 I/O pins, this component offers ample resources for data storage and connectivity, facilitating the development of sophisticated systems that require high-speed data processing and transfer.

Ideal for deployment in industries ranging from telecommunications to consumer electronics, and even in automotive applications, the Intel EPF10K30BC356-4 is characterized by its scalability and adaptability. Its Bulk packaging ensures that it meets the requirements of mass production, a testament to its reliability and the trust Intel places in its products. Remaining active in Intel’s portfolio, this FPGA continues to support engineers and developers in achieving their design ambitions, providing a foundation for innovation and advancing technological frontiers.