The EPF10K10QC208-4, manufactured by Intel, belongs to the critically acclaimed FLEX-10K® series of Field Programmable Gate Arrays (FPGAs). Housed in a 208-BFQFP (Bumpered Flat Quad Flat Package), this component offers a robust solution for surface-mount technology applications. With an operating temperature range of 0°C to 70°C, it ensures reliability across various environments.

This FPGA is equipped with 576 logic elements/cells, further organized into 72 logic array blocks (LABs) / configurable logic blocks (CLBs), making it highly versatile for complex digital circuit designs. It also features a substantial amount of onboard memory, with a total of 6144 RAM bits, facilitating efficient data storage and retrieval processes within the device.

The device’s 208-PQFP package, measuring 28×28, and a high count of 134 I/O pins support extensive connectivity options, making it ideal for a wide array of application requirements. Although marked as obsolete, the EPF10K10QC208-4 remains a preferred choice for legacy systems, offering a testament to its enduring utility and performance.

Predominantly utilized in the telecommunications, consumer electronics, and automotive industries, the FPGA’s adaptability and capacity for rapid prototyping and customization also render it suitable for research and development within cutting-edge technology sectors.

By leveraging the EPF10K10QC208-4, designers and engineers can achieve a delicate balance between complexity, performance, and cost-effectiveness in their digital system designs, ensuring that their projects remain at the forefront of technological innovation.