Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP4CE30F29I7N is a high-performance FPGA part of the esteemed Cyclone® IV E series, known for delivering cost-effective yet powerful solutions for a myriad of complex digital projects. With an impressive array of features packed into a 780-BGA package, this FPGA is designed for surface mounting and is capable of operating in extreme temperature conditions ranging from -40°C to 100°C (TJ), ensuring reliability and stability across various applications.
This component boasts 28,848 logic elements/cells and 1,803 LABs/CLBs, demonstrating its robustness and adaptability for intricate design requirements. The substantial 608,256 total RAM bits and 532 I/O pins facilitate extensive data storage and high-speed interfacing, respectively, making the EP4CE30F29I7N an ideal choice for demanding digital environments.
Presented in Tray packaging with a 780-FBGA (29×29) supplier device package, the Intel EP4CE30F29I7N sustains its status as an active part, reinforcing its ongoing relevance and utility in current technology landscapes. Its comprehensive capacity for design innovation renders it a paramount selection for use in a variety of industries, including but not limited to telecommunications, automotive, consumer electronics, and industrial automation, where reliability, efficiency, and processing power are of paramount importance.
In summary, the Intel EP4CE30F29I7N FPGA is engineered to meet the advanced requirements of complex digital system implementations, making it a critical component for developers looking to leverage superior performance, flexibility, and reliability in their projects.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 780-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 28848 |
Supplier Device Package | 780-FBGA (29x29) |
Number of LABs/CLBs | 1803 |
Total RAM Bits | 608256 |
Part Status | Active |
Number of I/O | 532 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
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TSSOP / 16 / 5X4MM-0
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DICE (WAFER SAWN) - WAFFLE PACK
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