Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP4CE115F23C7N, part of the esteemed Cyclone® IV E series, is a high-performance FPGA designed to meet the rigorous demands of various high-tech industries, including telecommunications, automotive systems, and consumer electronics. This FPGA is available in a 484-BGA package and utilizes surface mount technology for secure and reliable integration into a wide range of applications.
With a substantial number of logic elements, precisely 114,480, it offers an exceptional foundation for complex digital circuits. The device is structured around 7,155 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), providing a versatile and efficient architecture for the implementation of varied logic functions. Additionally, this component boasts 3,981,312 total RAM bits, enhancing its capability to handle extensive data processing and storage tasks.
Operating within a temperature range of 0°C to 85°C (TJ), the EP4CE115F23C7N ensures reliable performance across diverse environmental conditions. It also features a robust I/O count of 280, facilitating extensive connectivity and interfacing options with other components within a system.
Engineered for surface mount applications, its package dimensions are encapsulated within a 484-FBGA (23×23) format, asserting a compact footprint while maintaining its high functionality and flexibility. This component is currently active, indicating ongoing manufacturer support and availability for both new designs and legacy system maintenance.
The Intel EP4CE115F23C7N sets a high standard for FPGAs in terms of performance, versatility, and reliability, making it a key element in the development and refinement of cutting-edge technology across multiple sectors.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 114480 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 7155 |
Total RAM Bits | 3981312 |
Part Status | Active |
Number of I/O | 280 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 69 I/O 84PLCC
IC FPGA 315 I/O 484FBGA
IC FPGA 226 I/O 324CSBGA
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