The EP3C55F484C6N is a field-programmable gate array (FPGA) from Intel’s esteemed Cyclone® III series, designed to meet the demands of high-performance, low-power applications across various industries. It is currently available in an active state, showcasing Intel’s commitment to providing long-term support and availability for its products.

Key specifications of the EP3C55F484C6N include:
– Packaging in a tray format, making it suitable for bulk handling and production environments.
– A compact 484-ball fine-pitch ball grid array (FBGA) packaging, measuring 23x23mm, optimizing board space without compromising on performance.
– Surface mount technology for secure and efficient PCB assembly processes.
– An operating temperature range of 0°C to 85°C, ensuring reliable performance under varying environmental conditions.
– A robust configuration with 55,856 logic elements/cells and 3,491 logic array blocks (LABs)/ configurable logic blocks (CLBs), facilitating complex digital circuit designs.
– A substantial total of 2,396,160 RAM bits for extensive data storage and manipulation capabilities.
– A generous provision of 327 input/output pins, providing ample connectivity options for interfacing with other components and systems.

This FPGA is engineered for use across a diverse array of industries including telecommunications, automotive, industrial automation, and consumer electronics, to name a few. Its versatile feature set and Intel’s renowned manufacturing quality make the EP3C55F484C6N an ideal selection for developers and engineers looking for a reliable and efficient solution for their high-density, mixed-function projects.