Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP3C40U484I7, part of the renowned Cyclone® III series, stands out as a key FPGA (Field-Programmable Gate Array) component engineered to meet the sophisticated demands of modern digital applications. This high-performance part is housed in a 484-FBGA (Fine-Pitch Ball Grid Array) package, optimized for surface mount technology, ensuring seamless integration into a variety of circuit boards.
With an operating temperature range of -40°C to 100°C (TJ), this FPGA is designed for reliability and stability across diverse environments, making it an ideal choice for applications requiring extended temperature tolerances. The device boasts 39,600 logic elements/cells, 2,475 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), and 331 I/O pins, offering a flexible and scalable architecture for complex digital logic designs.
Further enhancing its utility, the EP3C40U484I7 features a total RAM capacity of 1,161,216 bits, providing substantial on-chip memory resources for data-intensive operations. Its packaging in a 484-UBGA (19×19) format underlines the component’s compactness, facilitating efficient use of board space without compromising on computational power or connectivity.
Active and consistently sought after in the market, this FPGA is pivotal in applications across various industries, notably in telecommunications, automotive systems, consumer electronics, and industrial automation. Its robust feature set and adaptability make it a cornerstone component for developers engineering the next generation of electronic innovations.
In summary, the Intel EP3C40U484I7 from the Cyclone® III series embodies a sophisticated blend of performance, flexibility, and reliability, establishing itself as a go-to FPGA for design engineers focused on creating cutting-edge applications.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-FBGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 39600 |
Supplier Device Package | 484-UBGA (19x19) |
Number of LABs/CLBs | 2475 |
Total RAM Bits | 1161216 |
Part Status | Active |
Number of I/O | 331 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 400 I/O 676FCBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA ARTIXUP 484BGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 83 I/O 100QFP
IC FPGA 532 I/O 780FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 387 I/O 676FBGA
IC FPGA 69 I/O 84PLCC
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