The EP3C40F780I7N, crafted by Intel, belongs to the innovative Cyclone® III FPGA series, showcasing advanced technology in field-programmable gate arrays. This component is encapsulated in a 780-pin Fine-Pitch Ball Grid Array (FBGA) package, ensuring a robust and efficient connection suited for surface mount technologies. It operates within a wide temperature range of -40°C to 100°C, catering to demanding applications.

Key features include:
– A substantial array of 39,600 logic elements/cells, facilitating complex logic circuits designs and implementations.
– A total of 2,475 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), enabling flexible arrangements for various design requirements.
– A generous provision of 1,161,216 total RAM bits, supporting extensive data storage and manipulation needs.
– An impressive number of 535 I/O pins, providing ample connectivity for intricate system integrations.
– Housed in a 780-FBGA package with dimensions of 29×29, designed for optimal space utilization and thermal management.

The EP3C40F780I7N FPGA finds its place in a wide range of applications, from aerospace and defense systems, where reliability under extreme conditions is paramount, to telecommunications and automotive industries, requiring high-speed data processing and advanced control functionalities. Its active part status ensures continued support and availability, making it a trustworthy choice for both current and future high-tech projects.