The EP3C40F780C6N, part of the esteemed Cyclone® III series from Intel, stands as a formidable FPGA (Field-Programmable Gate Array) engineered to cater to a range of high-performance applications. With its 780-BGA package design, this array is tailored for surface mount technology, ensuring a secure and reliable integration into various system architectures.

Operating within a temperature range of 0°C to 85°C (TJ), the EP3C40F780C6N is built to maintain optimal performance in diverse working environments. The component boasts a robust configuration of 39,600 logic elements/cells and 2,475 LABs/CLBs (Logic Array Blocks/Configurable Logic Blocks), delivering exceptional computational power and flexibility for complex digital processing tasks.

Embedded with a total of 1,161,216 RAM bits, this FPGA provides ample storage capabilities for user applications, enhancing data management efficiency. The substantial availability of 535 I/O ports further enables extensive connectivity options, facilitating seamless communication with external peripherals and other system components.

Supplied in tray packaging and bearing a 780-FBGA (29×29) supplier device package, the EP3C40F780C6N remains in an active part status, affirming its ongoing relevance and availability for cutting-edge projects.

Primarily utilized within the realms of telecommunications, networking, and industrial systems, this FPGA from Intel’s Cyclone® III series represents a critical component for developers seeking advanced processing power, versatility, and reliability in their digital solutions.