The EP3C25Q240C8N FPGA from Intel, belonging to the Cyclone® III series, represents a pinnacle in field-programmable gate array technology, tailored for high-demand computing solutions. Encased in a 240-BFQFP package, this component is designed for surface mount applications, guaranteeing a secure fit on printed circuit boards.

Key features of the EP3C25Q240C8N include:

– A robust number of logic elements/cells totaling 24,624, enabling complex digital circuit design.
– Incorporates 1,539 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), offering versatile programming possibilities.
– Ample storage facilitated by 608,256 total RAM bits, ensuring efficient data management and processing.
– Features 148 I/O pins, providing extensive connectivity options for peripheral devices.
– Operates reliably within a temperature range of 0°C to 85°C, ensuring stability across various environmental conditions.

This component, with its sophisticated architecture, is especially suited for applications requiring high processing power and speed, such as digital signal processing, automotive, telecommunications, and industrial control systems. The flexibility and scalability offered by the Cyclone® III EP3C25Q240C8N make it a go-to FPGA for engineers and designers looking to push the boundaries of digital system design.

Offered in a tray packaging, the EP3C25Q240C8N maintains its active part status, emphasizing its ongoing relevance in contemporary tech solutions. With Intel’s reputation for quality and innovation, this FPGA stands out as a crucial component in the development of cutting-edge technology projects.