The Intel EP3C25E144C8N is a high-performance FPGA component from the renowned Cyclone® III series, notable for its advanced features designed to meet the rigorous demands of a broad spectrum of industries. This component is packaged conveniently in a tray, ensuring secure handling and delivery. It is housed in a 144-LQFP Exposed Pad package, with a surface mount configuration for seamless integration into various circuit designs.

Boasting an operational temperature range of 0°C to 85°C (TJ), this FPGA is engineered for reliability in a variety of operating conditions. With a substantial number of logic elements, precisely 24,624, and 1,539 LABs/CLBs, the EP3C25E144C8N offers a versatile foundation for complex digital circuits. The integration of 608,256 total RAM bits further enhances its capacity for storing and manipulating data efficiently.

Equipped with 82 I/O pins, this FPGA allows for robust connectivity with other components, enabling the development of sophisticated digital systems. The package size is optimized at 144-EQFP (20×20), providing a compact solution that does not compromise on performance.

The EP3C25E144C8N is actively in production, signifying its ongoing relevance and reliability in the market. Its comprehensive feature set makes it well-suited for applications across various industries, such as telecommunications, automotive, consumer electronics, and more, where performance, reliability, and versatility are crucial.