The EP3C16F256C8N is a high-performance FPGA from Intel’s Cyclone® III series, meticulously engineered to meet the sophisticated demands of modern digital applications. Housed in a robust 256-LBGA package, this FPGA is designed for surface mount technology, ensuring a secure and efficient integration into a wide array of electronic assemblies.

Key to this component’s capabilities is its impressive array of logical features, including 15,408 logic elements/cells and 963 logic array blocks (LABs)/configurable logic blocks (CLBs), making it versatile for complex digital computations and signal processing tasks. Additionally, with 516,096 total RAM bits, it offers substantial data storage and retrieval capacity, crucial for high-speed data processing applications.

Operating within a temperature range of 0°C to 85°C (TJ), the EP3C16F256C8N ensures reliability and performance consistency across varied environmental conditions. This temperature resilience, coupled with its extensive I/O capability of 168 ports, underscores its adaptability to multifaceted electronic designs.

Presented in the 256-FBGA (17×17) supplier device package, this FPGA not only exemplifies high-density integration but also emphasizes Intel’s commitment to delivering compact, power-efficient solutions. Currently marked as active, the EP3C16F256C8N stands as a pivotal component for developers focused on creating leading-edge technology in sectors such as telecommunications, automotive, consumer electronics, and aerospace, where its blend of performance, scalability, and operational durability is of paramount importance.