The EP2S180F1508C3 is a high-performance FPGA from Intel, part of the renowned Stratix® II series distinguished by its robust architecture designed to meet the demands of high-speed and complex digital logic circuits. The component boasts bulk packaging and is housed in a 1508-BBGA, FCBGA package that supports surface mount technology, making it suitable for streamlined manufacturing and assembly processes.

This FPGA operates within a temperature range of 0°C to 85°C (TJ), ensuring reliable performance across various environmental conditions. Its supplier device package is a 1508-FBGA (30×30), which provides a compact yet efficient solution for implementing advanced digital computations and signal processing tasks.

Key features of the EP2S180F1508C3 include:

– Part of the high-speed Stratix® II FPGA series by Intel
– Encased in a 1508-BBGA, FCBGA package for optimal integration
– Surface mount technology compatible for efficient assembly
– Designed to operate reliably within a 0°C to 85°C temperature range
– Packaged in bulk for ease of procurement and inventory management

Its sophisticated architecture and high-speed performance make it an indispensable component across a wide range of industries, including telecommunications, data processing, industrial automation, and consumer electronics, where reliability, speed, and flexibility are paramount. The active status of this part ensures ongoing production and availability for both new designs and existing system upgrades requiring state-of-the-art FPGA technology.