The Intel EP2S180F1020C4 is a high-performance Field-Programmable Gate Array (FPGA) from the Stratix® II series, known for its advanced capabilities in logic integration and versatile application. This component is encapsulated within a 1020-Ball Ball Grid Array (BBGA) package, optimized for surface mounting on printed circuit boards. Its design facilitates a wide operating temperature range from 0°C to 85°C (TJ), ensuring reliability and performance stability across various environmental conditions. With an active part status, this FPGA is currently available for incorporation into high-tech designs and applications.

Key features of the EP2S180F1020C4 include:
– Manufacturer: Intel
– Series: Stratix® II
– Packaging: Bulk for efficiency in procurement and manufacturing processes
– Package / Case: 1020-BBGA, offering robust physical protection and connectivity
– Mounting Type: Surface Mount, for streamlined assembly processes
– Operating Temperature: 0°C ~ 85°C, accommodating a broad range of environmental conditions
– Supplier Device Package: 1020-FBGA (33×33), ensuring a compact footprint with high-density IO support
– Number of I/O: 742, allowing for extensive interfacing capabilities with other devices and systems

This FPGA is extensively utilized across various industries including telecommunications, data processing, military and defense, and aerospace, owing to its adaptability, high-speed processing capabilities, and substantial I/O count. Its strategic design and manufacturing by Intel underscore its suitability for complex, high-performance computing applications requiring extensive logic and programmability.