The EP2C70F672C6N, part of Intel’s Cyclone® II series, stands as a formidable FPGA (Field Programmable Gate Array) designed to meet the sophisticated needs of a myriad of applications in the electronics sphere. Encased in a 672-BGA package, this FPGA provides a surface mount solution, optimized for a wide operating temperature range from 0°C to 85°C (TJ), ensuring reliability in various environmental conditions.

With its substantial logic capacity, the device boasts 68,416 logic elements/cells and 4,276 LABs/CLBs, rendering it capable of tackling complex digital computations and processes. The integration of 1,152,000 total RAM bits enhances its performance in data-intensive operations, suitable for high-speed data processing applications.

This FPGA offers an expansive array of 422 I/O pins, facilitating versatile connectivity options for system integration within a compact 672-FBGA (27×27) supplier device package. Its robust configuration allows for the seamless implementation of customized logic designs, addressing the specific requirements of advanced technological solutions.

Predominantly utilized in telecommunications, automotive, consumer electronics, and industrial applications, the EP2C70F672C6N is engineered to support the development of high-performance, programmable electronic systems. Its active part status underscores its ongoing relevance and availability in the market.

Intel’s Cyclone® II series, recognized for its blend of power efficiency and performance capabilities, makes the EP2C70F672C6N a preferred choice for professionals seeking reliable and efficient FPGA solutions for their complex digital system designs.