The EP2C50F672I8, part of Intel’s renowned Cyclone® II FPGA series, stands out as a high-performance, feature-rich Field-Programmable Gate Array designed to meet the demanding requirements of a wide array of applications. This device is housed in a 672-BGA package with a surface mount configuration, making it suitable for compact and high-density board layouts.

With its operating temperature range of -40°C to 100°C (TJ), this FPGA is engineered for reliability and durability in varied environmental conditions. It boasts an impressive array of 50,528 logic elements/cells and 3,158 Logic Array Blocks/Configurable Logic Blocks (LABs/CLBs), enabling complex digital system implementations within a single chip.

The EP2C50F672I8 provides substantial data management capacity with its 594,432 total RAM bits and supports a wide interface with 450 available I/O pins, granting extensive connectivity options for peripheral devices. Its supplier device package, the 672-FBGA (27×27), is designed to optimize board space without compromising performance.

Active in part status, this FPGA is a critical component across various industries, including telecommunications, automotive, industrial automation, and consumer electronics, where high-speed data processing, signal conditioning, and system management are paramount. The Cyclone® II series is celebrated for its ability to offer a perfect blend of power and flexibility, enabling designers to achieve highly customized solutions that meet rigorous performance criteria. The EP2C50F672I8 continues this legacy, providing a versatile platform for innovation in complex electronic systems.