The EP2C50F672C6, part of Intel’s Cyclone® II FPGA series, offers a robust solution for complex digital computing needs. Packaged conveniently in a 672-BGA format, this surface mount FPGA is designed for streamlined implementation into a variety of circuit boards, featuring a standard 672-FBGA (27×27) supplier device package to ensure compatibility and ease of integration across diverse applications.

With a substantial 50,528 logic elements and 3,158 Logic Array Blocks (LABs), the EP2C50F672C6 can manage intricate logic functions and data processing tasks efficiently. Supporting this capability is its impressive 594,432 total RAM bits, enabling significant data storage and manipulation capacity. This FPGA also boasts 450 input/output pins, facilitating extensive connectivity options for various peripheral devices and systems.

Operating within a temperature range of 0°C to 85°C (TJ), this FPGA is engineered to maintain reliability and performance across a wide range of environmental conditions, making it a versatile choice for applications requiring stable operation in varying climatic circumstances.

The EP2C50F672C6 finds extensive utility across multiple industries, including but not limited to telecommunications, automotive, consumer electronics, and aerospace sectors, where its scalability, processing power, and configurability make it an integral component within both intricate and high-demand environments.

As an active component in the market, the EP2C50F672C6 continues to be a preferred choice for designers and engineers looking for a high-performance FPGA solution, leveraging Intel’s reputation for quality and innovation in the semiconductor domain.