Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP2C50F484I8 is a high-performance FPGA from Intel’s Cyclone® II series, designed to meet the advanced requirements of processing within a wide range of applications. Encased in a 484-ball grid array (BGA) package, this FPGA is optimized for surface mount technology, making it ideal for streamlined, space-constrained circuit board designs.
With an operational temperature range of -40°C to 100°C, this device ensures reliable performance under varying environmental conditions, making it suitable for deployment in sectors requiring high levels of durability and operational stability. The EP2C50F484I8 boasts a substantial logic capacity, featuring 50,528 logic elements/cells and 3,158 logic array blocks/cluster logic blocks (LABs/CLBs), providing ample space for complex digital logic circuits.
Moreover, the device is equipped with 594,432 total RAM bits, enhancing its capability for high-speed data processing and storage, a critical factor in applications such as signal processing and data communication. The FPGA also offers a versatile I/O count of 294, enabling extensive interfacing with other components of a system for both input and output functionalities.
Packaged in a 484-FBGA with dimensions of 23×23, the EP2C50F484I8 integrates seamlessly into a variety of hardware configurations, underscoring its flexibility and adaptability across different platforms. Its active part status confirms ongoing manufacturer support and availability, further attesting to its reliability and effectiveness for use in industries where technology is constantly advancing. This component is an excellent choice for professionals designing sophisticated electronic systems in fields like telecommunications, automotive systems, aerospace, and consumer electronics, where performance and reliability are paramount.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 50528 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 3158 |
Total RAM Bits | 594432 |
Part Status | Active |
Number of I/O | 294 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
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IC FPGA 285 I/O 484FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 72 I/O 84PLCC
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IC FPGA 387 I/O 676FBGA
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IC FPGA 387 I/O 676FBGA
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IC FPGA 81 I/O 100TQFP
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