Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The EP2C35F484I8, crafted by Intel, stands as a pivotal component within the Cyclone® II FPGA series. It is meticulously packaged in a 484-Ball Grid Array (BGA) format, tailored for surface mount technology, ensuring a seamless integration into various application boards. With its robust operating temperature range of -40°C to 100°C (TJ), this FPGA is designed for reliable performance across diverse environments.
Featuring an impressive array of 33,216 logic elements/cells combined with 2,076 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EP2C35F484I8 offers a flexible and scalable architecture. It is equipped to handle complex digital computations and signal processing tasks, making it a cornerstone for advanced electronics design. The device boasts a substantial memory capacity with 483,840 total RAM bits, accommodating a broad spectrum of data storage and manipulation requirements.
Boasting 322 input/output ports, this FPGA facilitates extensive connectivity options, allowing it to serve as a versatile interface between various components and systems. The Cyclone® II series, recognized for its efficiency and high performance, finds extensive application in telecommunications, automotive systems, consumer electronics, and industrial automation, affirming its status as a critical component in the design and development of next-generation electronic products. The EP2C35F484I8 remains in active production, underscoring its ongoing relevance and demand in specialized and high-tech industries.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 484-BGA |
Mounting Type | Surface Mount |
Operating Temperature | -40°C ~ 100°C (TJ) |
Voltage - Supply | 1.15V ~ 1.25V |
Number of Logic Elements/Cells | 33216 |
Supplier Device Package | 484-FBGA (23x23) |
Number of LABs/CLBs | 2076 |
Total RAM Bits | 483840 |
Part Status | Active |
Number of I/O | 322 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 400 I/O 676FCBGA
IC FPGA 300 I/O 536CSPBGA
IC FPGA 400 I/O 676FCBGA
IC FPGA 500 I/O 1156FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 322 I/O 484FBGA
IC FPGA 83 I/O 100QFP
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
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