Introducing the EP2AGX95EF29C4G from Intel, a high-performance FPGA from the esteemed Arria II GX series. This field-programmable gate array is a powerhouse of technology, engineered for surface mount application with a sophisticated 780-ball fine-pitch BGA package (780-FBGA, 29×29). Designed to meet the rigorous demands of various high-tech industries, including telecommunications, automotive systems, and aerospace, this component boasts an array of impressive features:

– Packaged in a tray for secure handling and delivery.
– Encapsulation within a 780-BBGA, FCBGA package ensuring robustness and reliability in physical installation.
– Operable across a temperature range of 0°C to 85°C (TJ), making it versatile for different environmental conditions.
– A substantial number of logic elements/cells totaling 89,178, providing ample space for complex logic implementations.
– The device comes in a 780-FBGA (29×29) supplier device package format.
– It encompasses 3,747 Logic Array Blocks/LABs/CLBs, facilitating efficient logical structuring and processing.
– An impressive total RAM bits of 6,839,296, offering significant memory capacity for demanding applications.
– The device maintains an active part status, indicating ongoing support and availability.
– It includes 372 I/O ports, ensuring extensive interfacing capabilities with other components and systems.

The EP2AGX95EF29C4G epitomizes cutting-edge technology with its expansive feature set. Its integration into systems assures an enhancement in performance, reliability, and versatility, making it a staple for developers looking to push the boundaries of what’s possible in electronic design and application across multiple industries.