Analog Devices Amplifiers
What are Amplifiers? Amplifiers are electronic devices that increase the amplitude of electronic devices that increase the amplitude of an electrical signal. They play a…
The Intel EP2AGX65DF29C4N FPGA, belonging to the Arria II GX series, is a high-performance, surface-mount FPGA presented in a 780-BBGA, FCBGA package designed for advanced applications. This component employs 60,214 logic elements/cells and 2,530 logic array blocks/CLBs that both define its capacity for handling complex digital computations and signal processing tasks efficiently. The device is encapsulated in a 780-FBGA (29×29) package, optimized for robust physical integration into a wide array of system architectures.
With a total of 5,371,904 RAM bits, the EP2AGX65DF29C4N provides substantial memory resources for high-speed data storage and retrieval, a critical requirement for data-intensive operations. Operating within a temperature range of 0°C to 85°C (TJ), it assures reliability across varied environmental conditions. This FPGA offers a generous provision of 364 I/O pins, facilitating extensive interfacing capabilities with other components in a system, enhancing its adaptability and utility in complex electronic assemblies.
Although now noted as obsolete, its high functionality caters well to sectors demanding superior computational power and high-speed data processing, such as telecommunications, data processing, and industrial applications. The Intel Arria II GX series is revered for its ability to deliver top-notch performance, especially in applications where processing efficiency and speed are paramount.
The EP2AGX65DF29C4N represents Intel’s commitment to producing advanced FPGAs capable of meeting the rigorous demands of today’s technology-driven industries, underlining its applicability in designing cutting-edge electronic systems that require high levels of logic integration and computational power.
Download Free CAD Model:
Packaging | Tray |
Package / Case | 780-BBGA, FCBGA |
Mounting Type | Surface Mount |
Operating Temperature | 0°C ~ 85°C (TJ) |
Voltage - Supply | 0.87V ~ 0.93V |
Number of Logic Elements/Cells | 60214 |
Supplier Device Package | 780-FBGA (29x29) |
Number of LABs/CLBs | 2530 |
Total RAM Bits | 5371904 |
Part Status | Obsolete |
Number of I/O | 364 |
Programmable | Not Verified |
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TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 5X4MM-0
DICE (WAFER SAWN) - WAFFLE PACK
PQFN / 24 / 4X4MM SLP - TAPE&RE
PQFN / 24 / 4X4MM S1 - TAPE&REE
DICE (WAFER SAWN) - WAFFLE PACK
TSSOP / 16 / 5X4MM-0
TSSOP / 16 / 4,4MM G1 - TAPE&REE
TSSOP / 16 / 5X4MM-0
SENSOR SIGNAL CONDITIONER 16TSSO
IC FPGA 500 I/O 900FCBGA
IC FPGA 140 I/O 176TQFP
IC FPGA 285 I/O 484FCBGA
IC FPGA 186 I/O 256FBGA
IC FPGA 83 I/O 100QFP
IC FPGA 532 I/O 780FBGA
IC FPGA 387 I/O 676FBGA
IC FPGA 113 I/O 144TQFP
IC FPGA 207 I/O 400VFBGA
IC FPGA 226 I/O 324CSBGA
IC FPGA 150 I/O 324CSBGA
IC FPGA 176 I/O 256UBGA
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