Intel’s Arria II GX series, particularly the EP2AGX65DF25I3N FPGA, is engineered for precision and performance, encapsulated in a 572-BGA, FCBGA package. This surface-mount component operates across a wide temperature range of -40°C to 100°C (TJ), ensuring reliability and robustness in various operational conditions. With 60,214 logic elements and 2,530 LABs/CLBs at its core, this FPGA offers a substantial platform for complex logic circuit implementations. The device is equipped with a significant memory capacity of 5,371,904 total RAM bits, catering to high-demand applications requiring extensive data management and storage solutions.

Designed with a supplier device package of 572-FBGA, FC (25×25) and supporting 252 I/O pins, this FPGA provides ample connectivity for a multitude of interfaces, ensuring versatile integration into broader systems. Despite its status as an obsolete component, the EP2AGX65DF25I3N remains a sought-after choice for developers and engineers involved in the creation of sophisticated electronic systems across various industries, including telecommunications, consumer electronics, and industrial automation, where its performance and capabilities continue to hold value.

By leveraging the advanced features of the Arria II GX series, the EP2AGX65DF25I3N from Intel delivers a compelling solution for complex digital processing tasks, underscoring Intel’s commitment to innovation and excellence in the field of programmable logic devices.