The EP2AGX65CU17C5N by Intel belongs to the advanced Arria II GX series of FPGAs, tailored for high-speed performance with a focus on power efficiency and lower system costs. It is crafted for surface mount technology with a 358-LFBGA (FCBGA) package, suitable for a wide range of operating temperatures from 0°C to 85°C (TJ), ensuring reliable performance across different environments.

This FPGA stands out due to its considerable logic capacity and flexibility, featuring 60,214 logic elements/cells and 2,530 Logic Array Blocks/LABs, combined with a substantial 5,371,904 total RAM bits. This makes the component exceptionally well-suited for sophisticated signal processing and high-speed data handling applications. With its 156 I/O pins, it allows for a broad range of connectivity options, enhancing its versatility in system integration.

The FPGA is currently classified as obsolete, signaling a limited availability that makes it a rare component for designs necessitating its specific attributes.

Key specifications include:

– Packaging in tray form factor for safe and secure delivery
– A compact 358-UBGA, FCBGA (17×17) package ensuring a reduced footprint
– Suited for complex projects with a high count of Logic Units
– Integrated features designed to facilitate efficient system development

Industries where EP2AGX65CU17C5N is extensively applied include, but are not limited to, telecommunications, automotive systems, and advanced digital signal processing. Its robust design and comprehensive feature set make it an ideal component for applications demanding high-speed data processing and significant logic capacity.