The EP2AGX45DF25C5G, from Intel’s renowned Arria II GX series, stands as a high-performance FPGA (Field-Programmable Gate Array), delivering exceptional functionality and versatility in a 572-BGA, FCBGA package. This component’s architecture is tailored for efficient surface mount application, ensuring compatibility with a wide array of PCB designs.

With an operating temperature range of 0°C to 85°C (TJ), this FPGA is resilient under varied environmental conditions, making it an ideal choice for demanding applications. It is equipped with 42,959 logic elements or cells, supporting intricate digital circuits designs with ease. Its structure also includes 1,805 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), providing a robust foundation for complex logic structuring.

The EP2AGX45DF25C5G excels in data storage and manipulation capabilities, featuring a total of 3,517,440 RAM bits. This substantial memory resource is invaluable for high-performance computing tasks and storage-intensive applications.

With 252 I/O pins, connectivity and interfacing options are extensive, allowing for flexible integration into a wide array of electronic systems. The package is provided in a 572-FBGA, FC (25×25) configuration, optimized for efficient PCB space utilization and thermal management.

Active in the Intel product portfolio, this FPGA is designed to meet the rigorous requirements of advanced digital and signal processing tasks. It is notably utilized across telecommunications, networking, and defense industries, where reliability and high-speed processing are paramount.

Overall, the EP2AGX45DF25C5G FPGA embodies a blend of high-density integration, superior performance, and versatility, satisfying the sophisticated needs of modern electronic systems design and implementation.