The EP2AGX125EF35I5, part of Intel’s esteemed Arria II GX series, stands out as a sophisticated Field-Programmable Gate Array (FPGA) designed to meet the stringent requirements of advanced digital circuitry tasks. This component is characterized by its high-density 1152-BBGA (FCBGA) packaging format, ensuring a robust surface mount solution for challenging environments, with an operating temperature range extending from -40°C to 100°C (TJ), thereby supporting a wide array of industrial applications.

With a staggering 118,143 logic elements/cells and 4,964 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EP2AGX125EF35I5 boasts a rich resource for complex digital logic functions. This FPGA is further enhanced by its substantial onboard memory, providing 8,315,904 total RAM bits, enabling extensive data storage and manipulation capabilities vital for high-performance computing, telecommunication infrastructure, and sophisticated signal processing tasks.

Furthermore, the device presents a generous offering of 452 input/output (I/O) ports, facilitating comprehensive interfacing with other components within a system. This extensive I/O capability, combined with the device’s significant logic and memory resources, underscores its suitability for a multitude of demanding applications across various industries.

Although marked as obsolete, the EP2AGX125EF35I5 remains a testament to Intel’s commitment to innovation in the FPGA domain, exemplifying the performance and versatility necessary for design engineers to tackle intricate challenges in circuit design and implementation. Its legacy continues to influence the development of cutting-edge applications in technology sectors that demand the highest levels of functionality and reliability.