The Intel EP2AGX125EF29C5G, part of the esteemed Arria II GX series, stands out in the FPGA category with its high-density integration and performance capabilities. This component is encapsulated in a 780-BBGA, FCBGA package, designed for surface mount applications, ensuring a seamless integration into various circuit boards. It operates efficiently within a temperature range of 0°C to 85°C (TJ), making it suitable for a wide range of environments and applications.

With an impressive array of 118,143 logic elements/cells and 4,964 LABs/CLBs, this FPGA facilitates the development of highly complex digital circuits, catering to the sophisticated needs of circuit designers and developers. The high total RAM bits of 8,315,904 enhance its capability to handle significant data processing tasks, suitable for demanding applications.

Furthermore, the EP2AGX125EF29C5G supports an ample number of I/O ports, totaling 372, providing extensive connectivity options for peripheral devices. Packaged in a 780-FBGA (29×29), it emphasizes a robust design optimized for durability and high performance.

This FPGA is especially relevant in industries requiring high-speed data processing and reliable performance, including but not limited to telecommunications, automotive, defense, and aerospace sectors. Its active part status underlines its ongoing relevance and availability in the market, ensuring that designers have access to top-tier components for their critical projects. The Arria II GX series remains a top choice for professionals seeking advanced features and reliability in their FPGA selections.