The Intel Stratix® EP1S30B956C7 FPGA offers a highly versatile solution for a wide range of applications across various industries including telecommunications, automotive, and data processing. This FPGA, featured in the Stratix® series, comes packaged in bulk, ensuring it is well-suited for volume procurement and integration into multiple system designs.

Housed in a 956-BBGA package, this component is designed for surface mount technology, allowing for seamless integration into a wide variety of printed circuit board designs. Its package dimensions, specifically a 40x40mm 956-BGA (Ball Grid Array), are crafted for efficient space utilization, critical in today’s high-density board designs.

With an impressive array of 683 I/O pins, the EP1S30B956C7 facilitates extensive connectivity options, making it an ideal choice for complex digital circuits requiring numerous input and output connections. This flexibility in connection makes it particularly useful for high-speed data transfer and signal processing tasks in sophisticated electronic systems.

This FPGA operates effectively within a temperature range of 0°C to 85°C (TJ), ensuring reliable performance under varied environmental conditions. This thermal specification underscores its suitability for use in systems where operational temperature can vary, such as outdoor telecommunications equipment or in-vehicle electronics in the automotive sector.

Continuously active, the Intel Stratix® EP1S30B956C7 remains an essential component for developers seeking robust, high-performance programmable logic solutions. Its commitment to supporting advanced system designs underscores its ongoing relevance in the development of cutting-edge technology across a broad spectrum of industries.