The EP1K10FC256-3N, manufactured by Intel, is part of the distinguished ACEX-1K® series, featuring Field Programmable Gate Arrays (FPGAs) known for their flexibility and efficiency in a wide range of applications. This advanced component is offered in a 256-Ball Grid Array (BGA) package that optimizes board space without compromising on performance, making it an ideal choice for high-density mounting requirements.

With an operating temperature range from 0°C to 70°C, this FPGA is designed to perform reliably in varied environmental conditions. The device boasts 576 logic elements/cells and 72 logic array blocks/CLBs, underpinning its capability to undertake complex processing tasks with ease. Furthermore, it integrates a total of 12,288 RAM bits, facilitating efficient data storage and retrieval operations which are crucial for high-speed processing applications.

The EP1K10FC256-3N offers an impressive array of 136 I/O pins, providing ample connectivity options for peripheral components, making it highly suitable for applications requiring extensive interface capabilities. Packaged in a 256-FBGA (17×17), it highlights Intel’s commitment to compact and efficient design principles.

Despite its status as an obsolete part, the EP1K10FC256-3N remains in demand across various industries for its robustness and versatility. Its specifications make it particularly well-suited for applications in telecommunications, computing, industrial control systems, and consumer electronics, where performance and reliability are of paramount importance. This FPGA stands as a testament to Intel’s engineering excellence, offering a blend of high performance, flexibility, and reliability for demanding application scenarios.