The Intel EP1K10FC256-3 FPGA, a part of the ACEX-1K® series, emerges as a highly versatile component under the FPGA category, offered in a 256-Ball Grid Array (BGA) package. Crafted for surface mount application, this product is poised to deliver exceptional performance within an operating temperature range of 0°C to 70°C. Incorporated with 576 logic elements and 72 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), it grants ample flexibility for intricate design implementations.

This FPGA is constructed with a total of 12288 RAM bits and provides an expansive interface potential through its 136 I/O pins, aligning with the diverse requirements of high-demand applications. Its supplier device package is specified as 256-FBGA, with dimensions being closely defined at 17×17, ensuring a compact footprint suitable for space-conscious designs.

Characterized by its obsolete status, the EP1K10FC256-3 still stands as a critical component within various industries, demonstrating robust application potential ranging from telecommunications to advanced computing systems, thanks to its substantial logic configuration capability and memory resources.

Tailored to meet the intricacies of advanced technological deployments, Intel’s EP1K10FC256-3 underlines a commitment to delivering high-quality, durable, and efficient FPGA solutions. The integration of such a component into systems points to a vast arena of possibilities, enhancing the performance and scope of modern digital and electronic paradigms.