This Intel Cyclone® series FPGA, model EP1C4F324C7, offers a highly versatile platform for developing complex digital logic circuits across a breadth of industries. Engineered with precision, its packaging in a 324-BGA format facilitates streamlined surface mount integration, aligning with modern circuit board designs for high-density applications. Despite its obsolescence status, this component remains a crucial element for legacy systems maintenance or specific application requirements where its unique specifications offer unmatched value.

Notable specifications include:
– Package / Case: 324-BGA, conducive for compact and efficient board layouts.
– The operating temperature range from 0°C to 85°C, accommodating ambient conditions in standard industrial environments.
– An expansive network of Logic Elements/Cells totaling 4000, enabling the execution of complex logic functions.
– A substantial count of 400 LABs/CLBs for versatile logical array block configuration.
– Total RAM Bits capped at 78336, providing ample memory space for intermediate data storage.
– Provision of 249 Input/Output pins, offering extensive interfacing capabilities with other components in a system.
– Encased in a Supplier Device Package of 324-FBGA (19×19), optimizing real estate on printed circuit boards.

The EP1C4F324C7 is particularly applicable in industries where reliability and the ability to handle intricate digital logic operations are paramount. This includes but is not limited to telecommunications, automotive, defense, and aerospace sectors where its performance and configurability can be leveraged for specialized tasks within system designs.