The EP1C12F324C8, produced by Intel, belongs to their esteemed Cyclone® series, targeting professionals in the field of FPGA (Field Programmable Gate Arrays) design and development. This specific model comes packed in a tray, indicating its readiness for bulk handling and assembly processes. With a 324-Ball Grid Array (BGA) package, its footprint is optimized for compact, high-density applications. The device’s surface mount configuration enables streamlined manufacturing and integration into various applications.

Featuring an impressive array of 12,060 logic elements/cells and 1,206 Logic Array Blocks (LABs)/Configurable Logic Blocks (CLBs), the EP1C12F324C8 provides a robust platform for intricate digital circuit designs. It offers substantial flexibility with 249 available I/O pins, catering to a wide array of connectivity requirements. Furthermore, with a total of 239,616 RAM bits, this FPGA offers ample memory resources for high-performance computing tasks.

Operating within a temperature range of 0°C to 85°C, it ensures reliability in environments that experience moderate thermal variations. The supply of this device in a 324-FBGA package underscores its suitability for projects demanding a compact form factor without compromising on performance capabilities.

It is important to note that this component is classified as obsolete, suggesting that while it remains a powerful tool for FPGA design, alternative or newer versions may be sought for future-proofing projects. Its use has spanned various industries, from telecommunications to consumer electronics, where high-speed data processing and flexible hardware configurations are paramount.